| 410 |
Ammonium
Persulphate |
| |
For
etching copper. Transparent solution. |
|
4101 | Sodium
Persulphate |
| For
etching copper. Replacement for Ammonium Persulfate. Compatible with etch resist
pens. |
| 415 |
Ferric Chloride |
| For
etching copper. |
| 416-E |
Professional Etching Process Kit |
| Etch
copper clad circuits professionally. |
| 416-ES |
Economy Etching Process Kit |
| Etch
copper clad circuits. Ideal for students and hobbyists. |
|
416-K |
Photofabrication Kit |
| Produce
your own circuit boards using the photofabrication method. |
| 416-X |
Exposure Kit |
| Contains major components required to expose presensitized copper clad boards. |
| 416DFR |
Dry Film Resist - Negative |
| |
For
creating professional looking boards quickly and easily. |
| 41600A |
Electroless Copper Plating Chemical Kit  |
| A key component of the MG Chemicals Professional Prototyping Process, which allows professional electronic engineers to prototype circuit boards with copper plated through holes themselves, avoiding having to send their designs to prototyping companies. |
| 41600B |
Electroless Copper Plating Hardware Kit |
| A key component of the MG Chemicals Professional Prototyping Process, which allows professional electronic engineers to prototype circuit boards with copper plated through holes themselves, avoiding having to send their designs to prototyping companies. |
| 41650 |
Electroplating Tank |
| Designed for use with the MG Professional Prototyping Process, but it will work with any electroplating system.
|
| 41660 |
Copper Bar Anode Set |
| Designed for use with MG Chemicals' Electroplating Tank and Copper Electroplating Solution. |
| 41662 |
Tin Bar Anode Set |
| Designed for use with MG Chemicals' Electroplating Tank and Tin Plating Solution.
|
| 41670 |
Copper Electroplating Solution |
| Ready to use electroplating solutions.
|
| 41672 |
Tin Electroplating Solution |
| Ready to use electroplating solutions. |
| 41692 |
Tin Stripper |
| Removes tin from copper in under 5 minutes. Simply submerge the tin plated board in solution and agitate. |
| 4170 |
Negative Developer |
| For developing boards laminated with MG Chemicals Negative Dry Film Resist. |
| 418 |
Positive Developer |
| For removing exposed photoresist. |
| 421 |
Liquid Tin |
| For tin plating circuit boards. |
| 500 |
Plain Copper Clad Boards |
| Thickness
in 1/16", 1/32", 1/64" are available in full 3' x 4' sheets or a variety of cut
sizes. |
| 500 |
Plain Copper Clad Boards (1/2 ounce) |
| Thickness in 1/16", 1/32", 1/64" are available in full 3' x 4' sheets or a variety of cut sizes. |
| 600 |
Copper Clad Boards Presensitized
with positive photo resist |
| Thickness
in 1/16", 1/32", 1/64" are available in a variety of cut sizes. |
| 840 |
Nickel Print |
| Conductive
paint for repairing traces on circuit boards. |
| 842 |
Silver Print |
| Conductive
paint for repairing traces on circuit boards. |
| 8420-P |
Silver Conductive Pen |
| Conductive
paint for repairing traces on circuit boards in a convient pen format. |
Prototyping
Materials 
